Company Profile

TTST is a national-level specialized and innovative "Little Giant" enterprise, dedicated to providing key process equipment for AI computing boards.

Our products are used in HDI-MSAP, AI computing boards, IC substrates, glass substrates, advanced packaging (PLP), and semiconductor (probe cards) fields.

The company focuses on two core areas: In the field of thick AI computing boards, we have a leading market share in equipment such as cutting and grinding lines, 

punching machines, hole-filling machines, and high aspect ratio electroplating;

In the field of fine circuit, our VCP electroplating and vertical developing/etching/film stripping lines meets the demands of cutting-edge processes. 


2018

Year
Company Establishment

7

Year
Independent Research and Development

90

+

Individual
Intellectual Property Rights

16

+

Item
cutting-edge equipment

26000

m2
Factory Area

1000

m2
Wet Method Laboratory
Multi Sub Brand Product Matrix
TNEO Electroplating

Sino-Korean joint venture holding brand TNEO Electroplating: Single-Panel atch plating、 VCP/Vertical plating、 chemical plating line


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  • · New Brand——Tailian Electric Hammer
  • · TAI-LIAN Team All Members~40+ Full-time Employees——International Technology, Made in China
  • · Tektronix Provides Parent Company Resource Guarantee
  • · Over 20 years of core team experience in the international brand industry, serving outstanding international clients
  • · VCP, Longmen Plating, Chemical Plating, Degumming, and various surface treatment equipment, possessing comprehensive and extensive experience
  • · Main Products: VCP Electroplating Line, 40:1 High Aspect Ratio Electroplating Line, Single Wafer Single Tank Electroplating Line
Xiangshun Factory

Wholly owned sub brand Machine Vision Focusing on OPE punching machine, PP punching machine, copper  foil punching machine


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  • · 4/8CCD Internal Bitwise Punching Mechanism
Medawei

Wholly-owned sub-brand Maidawei specializes in vertical/horizontal development, etching, and film removal


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  • · Vertical Projection Engraving Film Removal Equipment
  • · Horizontal Projection Engraving Film Removal Equipment
Medap

Medap Semiconductor, founded in 2008, is an international innovative company that integrates manufacturing and agency sales services.

We are committed to providing high-tech, high-quality equipment, materials, and comprehensive technical support and services to customers in the electronics industry.


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  • · 2F46 Mask Laser Exposure Machine
  • · Dynamic Welding Line Detector
  • · Dynamic Optics Detection and Measurement System
  • · Probe card needle adjustment machine
Development History
2018-2020
2021-2022
2023
2024
2025
2018-2020
  • Establishment of Techist Company

  • Launch of New Product: Fully Automatic Cutting and Grinding Line

  • Establishment of Subsidiary Xiangshun – Localization of OPE Punching Machines

  • First Export Regions for Products: Europe and Southeast Asia

  • Awarded "National High-Tech Enterprise" Recognition

2021-2022
  • Subsidiary Mida Microelectronics Established

  • New Product Launch: Vertical Wet Process Line

  • Domestic Pioneer in Advanced Semiconductor Wet Process Equipment Localization

  • Cumulative Product Shipment Volume Ranks First

  • New Product Launch: Backside Thickness Measurement Machine, Bending and Leveling Machine

  • Subsidiary Mida Pu Semiconductor Established, Entering the Semiconductor Field

2023
  • Completion of the first domestic fine-line circuit board with wide line spacing

  • Advanced wet process equipment research and development laboratory

  • New product launch: Horizontal wet process line

  • Collaboration with South Korean company DIB

  • New product launch: Tunnel oven

  • Collaboration with South Korean company DHE — Localization of coreless laminating machine, ABF film peeling machine, and copper foil tearing machine

  • Awarded as a Shenzhen "Specialized, Refined, Distinctive, and Innovative" enterprise

2024
  • Headquarters factory relocated to new address in Bao'an, Shenzhen

  • Signed strategic agreement with South Korea's NEOPMC, both parties registered

  • Established China joint venture company—Tailian Dianlu TNEO—localization of VCP-type/Dragon Gate-type electroplating lines and chemical plating lines

  • Products first exported to regions: Japan, South Korea, Taiwan region

2025
  • New Dongguan factory established, dedicated to manufacturing workshops for TNEO Tai Lian electroplating equipment

  • First 40:1 high aspect ratio VP dragon gate electroplating line shipped

  • First mSAP VCP electroplating line shipped

  • Dedicated supporting industry chain for AI computing power server dragon head

  • Equipment R&D laboratory expanded and upgraded

  • Newly developed equipment covers electroplating, etching, developing, stripping, etc., applied across fields including PCB-mSAP, IC substrates, glass-based substrates, advanced packaging FOPLP-RDL, etc.

  • New products launched: vertical double-sided screen printer, fully automatic resin vacuum hole filling machine

R&D Strength

3000

+

Ten thousand yuan
Significant investment, backed by high-end equipment

20

+

Year
Zishen Team, Technical Experience Escort

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Domestic First High-End Wet Process Equipment Laboratory
  • R&D Objective: 2-25μm Ultra-Fine Line Width and Line Pitch Equipment Solution, Innovative Technology Processes and Design, Cutting-Edge Application Fields
  • Occupied area 1000m²
  • Comprehensive Support for Customer Sample Delivery Testing and Verification
Superfine Circuit Line Exposure Uniformity, Etching Uniformity, and Comprehensive Performance of Demembrane Refinement.

Superfine Circuit Line Exposure Uniformity, Etching Uniformity, and Comprehensive Performance of Demembrane Refinement.

Example of Averaging

Example of Averaging

Test Content

The laboratory includes VCP electric furnace equipment, vertical projection, etching, descumming equipment, tunnel furnace equipment, horizontal vacuum etching equipment, etc., focusing on the technological research and development and process optimization of 2-25μm fine circuit pattern engineering equipment.

Test Content

Customer Real Test Data Display

Honorary Qualifications
Ministry of Science and Technology National High-Tech Enterprise
Guangdong Famous Brands
Innovation Contribution Award
Guangdong Province Famous High-Tech Products
GPCA Board of Directors Member Units
2024 Founder PCB Honor Certificate
Partner
Business Layout

Japan

South Korea

Shenzhen

Dongguan

Taiwan

Thailand

Europe

Japan Office:
Japan Office:
〒104-0061 Chuo-ku, Tokyo, Ginza 1-16-7, Ginza Daiichi Building 5F
Telephone:
Telephone:
03-4360-8789
Telephone:
Telephone:
08051331314
Email:
Email:
zs sato@chinattst.com
South Korea Office:
South Korea Office:
No. 547, Jianduan Road, Suwon District, Anyang City, Gyeonggi Province
Telephone:
Telephone:
18576423732
Email:
Email:
tony.lee@chinattst.com
Taike Site Group Headquarters
Taike Site Group Headquarters
Shenzhen Bao'an District Fuhai Street Shenghe Industrial Park Building D (TTST) Campus
Guangdong Tailian Advanced Equipment Co., Ltd.
Guangdong Tailian Advanced Equipment Co., Ltd.
Guangdong Province Dongguan City Guangdong Province Dongguan City Wantou Road No. 6
Email:
Email:
Johnny.xie@chinattst.com
Taiwan Office:
Taiwan Office:
7th Floor, No. 49, Lane 1, Qingfeng Road, Zhongli District, Taoyuan City
Telephone:
Telephone:
0917663456 (+86917663456)
Email:
Email:
yangdewei@chinattst.com
Thailand Office:
Thailand Office:
78/16 Wara Ville 2 · Soi Ngeon Lan, Bang Khu Wat, Mueang Pathum Thani, Pathum Thani, 12000
Telephone:
Telephone:
0924070868 (+66924070868)
Email:
Email:
yangdewei@chinattst.com
European Office:
European Office:
Münichreiterstraße 7 Wien 1130 Austria
Email:
Email:
huangfeikun@chinatts.com
期待您的沟通!

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