TTST is a national-level specialized and innovative "Little Giant" enterprise, dedicated to providing key process equipment for AI computing boards.
Our products are used in HDI-MSAP, AI computing boards, IC substrates, glass substrates, advanced packaging (PLP), and semiconductor (probe cards) fields.
The company focuses on two core areas: In the field of thick AI computing boards, we have a leading market share in equipment such as cutting and grinding lines,
punching machines, hole-filling machines, and high aspect ratio electroplating;
In the field of fine circuit, our VCP electroplating and vertical developing/etching/film stripping lines meets the demands of cutting-edge processes.
2018
Year7
Year90
+
Individual16
+
Item26000
m21000
m2
Sino-Korean joint venture holding brand TNEO Electroplating: Single-Panel atch plating、 VCP/Vertical plating、 chemical plating line
Wholly owned sub brand Machine Vision Focusing on OPE punching machine, PP punching machine, copper foil punching machine
Wholly-owned sub-brand Maidawei specializes in vertical/horizontal development, etching, and film removal
Medap Semiconductor, founded in 2008, is an international innovative company that integrates manufacturing and agency sales services.
We are committed to providing high-tech, high-quality equipment, materials, and comprehensive technical support and services to customers in the electronics industry.
3000
+
Ten thousand yuan20
+
Year
Japan
South Korea
Shenzhen
Dongguan
Taiwan
Thailand
Europe