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Congratulations – TNEO Tailian Ships 40:1 High Aspect Ratio Gantry Plating Line
On the evening of August 29, 2025, the high-aspect-ratio 40:1 gantry plating line (0.15mm aperture) manufactured by TNEO, a joint venture subsidiary of TTST, was officially delivered. This milestone signifies the successful completion of all technical tests and, more importantly, its validation through in-depth customer applications, demonstrating TNEO's leading technological prowess and market responsiveness in the high-end electroplating equipment sector.
Specifications:
Processing Dimensions: Min: 400×500 mm, Max: 600×800 mm (Customizable)
Processing Thickness: 0.1–10 mm (Customizable)
Plating Uniformity: ≤±10%
High Aspect Ratio: 40:1 (Aperture: 0.15 mm)
The successful manufacturing and shipment of TNEO's 40:1 high-aspect-ratio gantry plating line in China not only consolidates TTST's technological position in high-end PCB equipment manufacturing, but also provides critical process support for domestic industries such as AI servers and advanced packaging. This achievement demonstrates the collaborative innovation strength of domestic high-end equipment integrated with international technologies. Moving forward, TNEO will continue to deepen technological R&D and customer service, empowering the global electronics manufacturing industry to achieve higher precision and reliability.
TNEO Provides High-End Plating Solutions for Distinguished Chinese Clients:
High Aspect Ratio Gantry Plating: 40:1 (Aperture: 0.15 mm, Cu Plating Deviation: ±10%), primarily for AI server boards.
VCP Plating: High-uniformity plating equipment for IC substrates (CSP, FCBGA) and optical modules utilizing mSAP/SAP processes (Cu Plating Deviation: ±7%).
Single-Wafer Single-Tank Plating: FCBGA copper pillar and TGV plating (Cu Plating Deviation: ±3%).
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