AI Computing‑Power PCB & High‑End Substrate Presses Land in China｜TTST Forms Joint Venture with South Korea’s FUSEI MENIX

On July 7, 2026, TTST and FUSEI MENIX, a renowned South Korean manufacturer of lamination equipment, officially signed a strategic cooperation agreement to jointly establish a joint venture in China. Centered on high-end presses for AI computing PCBs and substrates, both parties will deepen their layout across the full global industrial chain of computing hardware.

FUSEI MENIX 总裁崔秉喆(Daniel Choi)、首席财务官全珪澈(Ian Jeon)、首席营销官李榮根(James Lee)，以及TTST泰科思特董事长李哲轩、总经理杨堤光等双方高层齐聚签约现场，共同见证这一历史性合作时刻。

（Top management representatives of FUSEI MENIX and TTST were present at the signing ceremony to mark this historic cooperation. Attendees comprised FUSEI MENIX President Daniel Choi, CFO Ian Jeon, CMO James Lee, alongside TTST Chairman Billy Lee and CEO Martin Yang.）

▲TTST 董事长李哲轩（Chairman Billy Lee）

▲FUSEI MENIX 总裁崔秉喆（President Daniel Choi）

Centered on high-end presses for AI computing PCBs and IC substrates, the partnership will fully integrate the three core strengths of both parties technology, production capacity and sales channels, to deliver two key strategic objectives as follows:

Joint R&D of computing-grade high-end presses:To meet the manufacturing requirements of ultra-multilayer PCBs for AI servers, high-order HDI and IC substrates, the two sides will co-develop high-precision vacuum hot pressing machines with optimized performance in temperature uniformity, pressure uniformity and vacuum tightness.

（Joint construction of mass production capacity for computing presses: Leveraging China’s complete supply chain ecosystem and sophisticated industrial supporting facilities, the joint venture will significantly shorten order delivery lead times for leading computing clients, precisely catering to the large-scale capacity expansion demand of global AI computing infrastructure.）

The signing of this joint venture agreement carries far-reaching significance：On one hand, it marks TTST’s official entry into the core track of high-end presses for AI computing applications, filling the critical gap in its portfolio of high-end PCB manufacturing process equipment. On the other hand, it represents a landmark milestone for cross-border collaborative innovation between advanced manufacturing enterprises from China and South Korea.

TTST stated that going forward, together with FUSEI MENIX, the two parties will continue to deepen their presence across the entire upstream and downstream industrial chain centered on high-end presses for AI computing PCBs and IC substrates. The joint venture aims to build a benchmark cross-border cooperation enterprise for high-end precision equipment between China and South Korea, and contribute domestically manufactured high-end equipment to the development of global AI computing infrastructure.

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